RFI Shielding Limited RFI Shielding Limited RFI Shielding Limited
RFI Shielding Limited RFI Shielding Limited
RFI Shielding Limited
RFI Shielding Limited RFI Shielding Limited
RFI Shielding Limited RFI Shielding Limited
RFI Shielding News

XyShield® XY300
...the next generation of Form-in-Place Materials...

Extensive research and applications experience result in new material development

RFI's commitment to continually improve and enhance our XyShield® product portfolio, together with both an accumulation of application experience and a close working relationship with our customers, has resulted in 'the Next Generation of Form-in-Place Materials' - XY300.


RFI Shielding Limited

XY300 has several enhanced characteristics:

  • Improved Electrical Performance;
    XY300 has a much Lower Volume Resistivity compared with previous XyShield® versions. It maintains an electrical path between surfaces through a much wider deflection range - 10-60% compression.

  • Greater Working Deflection Range; XY300
    removes some of the constraints placed on designers, as a standard cross-section gasket will now accommodate greater tolerances on mating surfaces.

  • Very Low Resistance Contact,
    achieved with minimal deflection/pressure; the filler system in XY300 has been engineered to ensure electrical contact at the extremes of deflection, and with less than ideal substrates.

  • Improved Compatibility with a wider range of substrates;
    including materials subject to forming resistive oxide layers; XY300 is compatible with
    • Electroless & Electrolytic Nickel
    • Silver & Copper Loaded Paints
    • Sputtered & Evaporated Aluminium
    • Aluminium Alloys (Natural & Chromate Conversion)
    • Die Cast Alloys
    • Magnesium Alloys

  • XY300 is also compatible with most other metals and conductive substrates - please contact us for detailed information.

  • Excellent Long Term Ageing Characteristics;
    the electrical performance of XY300 does not degrade appreciably, even under long term exposure to extremes of temperature.
  • XY300 has a low compound density, a direct result of the highly efficient filler matrix. This gives more components per unit weight of material than could be achieved using alternative Form-in-Place materials.

    To discuss your application needs, or for more detailed information about XyShield® XY300 and the XyShield® Form-in-Place Process, please contact us directl

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