research and applications experience result in new material development
to continually improve and enhance our XyShield®
product portfolio, together with both an accumulation of application experience
and a close working relationship with our customers, has resulted in 'the
Next Generation of Form-in-Place Materials' - XY300.
has several enhanced characteristics:
XY300 has a much Lower Volume Resistivity compared with previous
It maintains an electrical path between surfaces through a much wider
deflection range - 10-60% compression.
Working Deflection Range; XY300
removes some of the constraints placed on designers, as a standard cross-section
gasket will now accommodate greater tolerances on mating surfaces.
Low Resistance Contact,
achieved with minimal deflection/pressure; the filler system in XY300
has been engineered to ensure electrical contact at the extremes of
deflection, and with less than ideal substrates.
Compatibility with a wider range of substrates;
including materials subject to forming resistive oxide layers; XY300
is compatible with
& Electrolytic Nickel
& Copper Loaded Paints
& Evaporated Aluminium
Alloys (Natural & Chromate Conversion)
is also compatible with most other metals and conductive substrates
- please contact us for detailed information.
Long Term Ageing Characteristics;
the electrical performance of XY300 does not degrade appreciably,
even under long term exposure to extremes of temperature.
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